At GSMA Mobile World Congress, Texas Instruments DLP Products announced the newest chipset in the DLP Pico family with availability slated for late 2009. Small enough to embed into the most compact mobile phones and gadgets, DLP Products has effectively scaled the display technology down to the size of a raisin trying very hard not to compromise on picture quality and screen size.
"Building upon the success of the first DLP Pico chipset, which has HVGA resolution and enables leading brands to deliver cutting-edge products across the globe, this new chipset increases performance benchmarks," said Frank J. Moizio, Manager, DLP Emerging Markets business. "The new chipset provides WVGA resolution, higher brightness and power efficiency; all while enabling thinner, smaller optical engine modules to meet the demands of contemporary handheld devices."
The newest DLP Pico chipset can be paired with a TI OMAP application processor to deliver the ultimate mobile user experience. The DLP Pico chipset is a combination of the DLP Pico chip and the DLP Pico processor. It is optimized for applications in mobile and handheld devices.
The new DLP Pico solution delivers the following features:
* WVGA (854x480) - Native DVD resolution
* Enables >20% thinner optical module height
* Enables >20% smaller optical module volume
* Incorporates technology advances that increase both brightness and power efficiency
* Enables industry leading contrast ratio of better than 1000:1
* Impressive full RGB color gamut
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